The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jul. 14, 2022
Applicant:

Taiwan Semicondutor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ting-Yu Yeh, Hsinchu, TW;

Han-Hsiang Huang, Hsinchu, TW;

Chun-Hsien Wen, Hsinchu, TW;

Chih-Wei Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/20 (2013.01); H01L 22/14 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 2224/19 (2013.01); H01L 2224/2105 (2013.01); H01L 2224/211 (2013.01); H01L 2224/221 (2013.01); H01L 2224/24137 (2013.01);
Abstract

A semiconductor device includes a first connector, a second connector, and a redistribution structure disposed between the first connector and the second connector. The redistribution structure includes a first connection tree electrically connecting the first connector to the second connector. The first connection tree includes a plurality of first conductive pads disposed in a plurality of respective levels, and a plurality of first via structures each disposed between adjacent ones of the plurality of first conductive pads. Any lateral end of each of the plurality of first conductive pads is spaced from the first connector within a first minimum pitch associated with the second connector.


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