IDiyas

For the Inventor, By the Inventor

Hamburg, Germany

Guido Albermann

USPTO Granted Patents = 11 

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 46(Granted Patents)


Company Filing History:

goldMedal11 out of 5,113 
 
Nxp B.v.
 patents

Years Active: 2013-2024

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11 patents (USPTO):
1. 11881425 - Technique for handling diced wafers of integrated circuits (2024-01-23),
2. 11508606 - Technique for handling diced wafers of integrated circuits (2022-11-22),
3. 10896878 - Integrated circuit saw bow break point (2021-01-19),
4. 10347534 - Variable stealth laser dicing process (2019-07-09),
5. 9847258 - Plasma dicing with blade saw patterned underside mask (2017-12-19),
6. 9812361 - Combination grinding after laser (GAL) and laser on-off function to increase die strength (2017-11-07),
7. 9601437 - Plasma etching and stealth dicing laser process (2017-03-21),
8. 9349645 - Apparatus, device and method for wafer dicing (2016-05-24),
9. 8895363 - Die preparation for wafer-level chip scale package (WLCSP) (2014-11-25),
10. 8809166 - High die strength semiconductor wafer processing method and system (2014-08-19),
11. 8415769 - Integrated circuits on a wafer and method for separating integrated circuits on a wafer (2013-04-09),

Title: Innovations by Guido Albermann

Introduction

Guido Albermann is a notable inventor based in Hamburg, Germany. He has made significant contributions to the field of integrated circuits, holding a total of 11 patents. His work focuses on improving the handling and efficiency of integrated circuit assemblies.

Latest Patents

One of Albermann's latest patents is a technique for handling diced wafers of integrated circuits. This innovative method involves placing an integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame. The assembly is then covered with a top FFC frame that has a central opening. By mating the top and bottom FFC frames, the dicing tape is pulled over the structure, which laterally stretches the tape. This process breaks the wafer saw bows that hold the integrated circuits together. The lateral stretching increases the distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions. This innovation inhibits collisions during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, leading to more efficient shipment and storage.

Career Highlights

Guido Albermann is currently employed at NXP B.V., where he continues to develop and refine his innovative techniques. His work has garnered attention for its practical applications in the electronics industry.

Collaborations

Albermann collaborates with talented coworkers, including Hartmut Buenning and Sascha Moeller. Their combined expertise contributes to the advancement of technology in their field.

Conclusion

Guido Albermann's contributions to the field of integrated circuits demonstrate his commitment to innovation and efficiency. His patented techniques are paving the way for advancements in the handling of integrated circuit assemblies.

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