The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2021
Filed:
Jun. 18, 2019
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Antonius Hendrikus Jozef Kamphuis, Lent, NL;
Johannes Cobussen, Beuningen, NL;
Christian Zenz, Graz, AT;
Guido Albermann, Hamburg, DE;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/78 (2006.01); H01L 23/58 (2006.01); H01L 23/52 (2006.01); H01L 21/66 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); H01L 22/32 (2013.01); H01L 22/34 (2013.01); H01L 23/52 (2013.01); H01L 23/585 (2013.01);
Abstract
A saw bow is provided and designed such that the conductors of the saw bow will break at a predictable location when using modern dicing techniques. This results in a break in the circuit provided by the saw bow, with any exposed conductors not being on the die side. Further, by providing a known breaking point in the saw bow, modern dicing techniques such as plasma dicing can be used, thereby allowing for the saw lane to be made narrower, which will in turn increase the number of wafers that can be included on a wafer.