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For the Inventor, By the Inventor

Shanghai, China

GuangCai Fu

This inventor holds 10 USPTO granted patents. Top assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation, Shanghai Huali Integrated Circuit Corporation. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: GuangCai Fu. Retrieved from https://idiyas.com/inventor/guangcai-fu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal9 out of 1,756 
 
Semiconductor Manufacturing International (Shanghai) Corporation
 patents
silverMedal4 out of 950 
 
Semiconductor Manufacturing International (Beijing) Corporation
 patents
bronzeMedal1 out of 138 
 
Shanghai Huali Integrated Circuit Corporation
 patents
where one patent can have more than one assignee

Years Active: 2016-2026

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10 patents (USPTO):Explore Patents
1. 12527018 - Method for manufacturing metal zero layer (2026-01-13),
2. 11510011 - Microphone and manufacture thereof (2022-11-22),
3. 10834509 - Microphone and manufacture thereof (2020-11-10),
4. 10633247 - Semiconductor device and manufacture thereof (2020-04-28),
5. 10629808 - Phase change random access memory and fabrication method thereof (2020-04-21),
6. 10351421 - Semiconductor device and manufacture thereof (2019-07-16),
7. 9875965 - Semiconductor device (2018-01-23),
8. 9751750 - MEMS pressure sensor with thermal compensation (2017-09-05),
9. 9573805 - MEMS pressure sensor and method of manufacturing the same (2017-02-21),
10. 9416004 - Semiconductor device and fabrication method (2016-08-16),

Title: Innovations of GuangCai Fu

Introduction

GuangCai Fu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative work has advanced various manufacturing processes and techniques.

Latest Patents

One of his latest patents is titled "Method for manufacturing metal zero layer." This patent discloses a comprehensive method that includes etching a zero interlayer film to form a trench, performing Ge ion implantation to create layers, and achieving planarization through chemical mechanical polishing. Another notable patent is for a "Microphone and manufacture thereof," which details a microphone design that enhances bonding quality between its components, thereby improving performance.

Career Highlights

GuangCai Fu has worked with leading companies in the semiconductor industry, including Semiconductor Manufacturing International Corporation in Shanghai and Beijing. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies.

Collaborations

He has collaborated with notable colleagues such as Tianlun Yang and Xiaoping Zhang, further enriching his work and expanding the impact of his inventions.

Conclusion

GuangCai Fu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods and designs continue to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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