San Jose, CA, United States of America

Garlen C Leung

USPTO Granted Patents = 11 

Average Co-Inventor Count = 6.4

ph-index = 5

Forward Citations = 74(Granted Patents)


Location History:

  • Cupertino, CA (US) (2006)
  • San Jose, CA (US) (2007 - 2017)
  • Campbell, CA (US) (2020)

Company Filing History:


Years Active: 2006-2020

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11 patents (USPTO):Explore Patents

Title: Garlen C Leung: Innovator in Polishing Technology

Introduction

Garlen C Leung is a prominent inventor based in San Jose, CA, known for his significant contributions to polishing technology. With a total of 11 patents to his name, he has made remarkable advancements in methods that enhance the efficiency and precision of polishing processes in semiconductor manufacturing.

Latest Patents

Among his latest patents, Garlen has developed innovative methods for controlling polishing. One notable patent is titled "Polishing with measurement prior to deposition of outer layer." This method involves storing a base measurement of a substrate after the deposition of at least one layer and before the outer layer. It utilizes an in-situ monitoring system to receive a sequence of raw measurements during polishing, allowing for the determination of a polishing endpoint or an adjustment for the polishing rate based on normalized measurements. Another significant patent is "Polishing with pre deposition spectrum," which focuses on controlling polishing by normalizing raw spectra of light reflected from the substrate. This method also aims to determine polishing endpoints or adjustments based on normalized predetermined spectra.

Career Highlights

Garlen C Leung is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. His work at Applied Materials has positioned him as a key player in the development of advanced polishing technologies that are crucial for the production of high-quality semiconductor devices.

Collaborations

Throughout his career, Garlen has collaborated with notable colleagues, including Gregory E Menk and Peter McReynolds. These collaborations have further enriched his work and contributed to the innovative solutions he has developed in the field of polishing technology.

Conclusion

Garlen C Leung's contributions to polishing technology through his patents and work at Applied Materials, Inc. highlight his role as a significant innovator in the semiconductor industry. His advancements continue to influence the efficiency and effectiveness of polishing processes, making a lasting impact on the field.

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