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For the Inventor, By the Inventor

Tainan, Taiwan

Fu-Cheng Chang

USPTO Granted Patents = 32 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 21(Granted Patents)


Location History:

  • Hsinchu, TW (2023)
  • Tainan, TW (2016 - 2024)

Company Filing History:

goldMedal32 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2016-2025

where 'Filed Patents' based on already Granted Patents

32 patents (USPTO):
1. 12457816 - Wide channel semiconductor device (2025-10-28),
2. 12376417 - Semiconductor device with nanostructures (2025-07-29),
3. 12243772 - Protection structures for bonded wafers (2025-03-04),
4. 12125864 - Image sensor and method of making (2024-10-22),
5. 12107104 - Backside refraction layer for backside illuminated image sensor and methods of forming the same (2024-10-01),
6. 11901305 - Method for fabricating semiconductor structure having alignment mark feature (2024-02-13),
7. 11791205 - Protection structures for bonded wafers (2023-10-17),
8. 11784198 - Wide channel semiconductor device (2023-10-10),
9. 11777040 - Semiconductor device with nanostructures (2023-10-03),
10. 11764062 - Method of forming semiconductor structure (2023-09-19),
11. 11676980 - Image sensor and method of making (2023-06-13),
12. 11664403 - Manufacturing method of image sensor device having metal grid partially embedded in buffer layer (2023-05-30),
13. 11581349 - Backside refraction layer for backside illuminated image sensor and methods of forming the same (2023-02-14),
14. 11515435 - Semiconductor device with nanostructures and methods of forming the same (2022-11-29),
15. 11380721 - Wide channel gate structure (2022-07-05),

Title: Innovations by Fu-Cheng Chang: A Pioneer in Semiconductor Technology

Introduction

Fu-Cheng Chang, based in Tainan, Taiwan, is a notable inventor in the field of semiconductor technology, holding an impressive portfolio of 30 patents. His innovative approaches have propelled advancements in the design and manufacture of semiconductor devices, showcasing his expertise in developing cutting-edge technologies.

Latest Patents

Among his latest patents, Fu-Cheng Chang has developed a method for creating protection structures for bonded wafers. This method involves carefully bonding two wafers while employing dielectric layers and a metal pipe for structural integrity. The innovative design features a dielectric region with intricate steps that allow for precise etching to create conductive pathways.

Another significant patent focuses on the methods of making an image sensor. This invention includes the deposition of a shield layer over a substrate containing multiple photodiodes. The process features aligned recesses that incorporate a flicker reduction layer, which is essential for improving the performance of image sensors by minimizing flicker.

Career Highlights

Currently, Fu-Cheng Chang is associated with Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor industry. His work has been influential not only in advancing current technologies but also in paving the way for future innovations in semiconductor manufacturing processes.

Collaborations

Fu-Cheng Chang has collaborated with esteemed colleagues, including Ching-Hung Kao and Chia-Pin Cheng. These partnerships underscore the collaborative nature of innovation in the semiconductor field, where teamwork and shared expertise are crucial for developing groundbreaking solutions.

Conclusion

With an impressive track record of 30 patents, Fu-Cheng Chang continues to be a driving force in semiconductor technology. His recent innovations, particularly in wafer bonding and image sensor design, exemplify his commitment to enhancing device performance and reliability. As he continues to innovate, the impact of his work will likely resonate throughout the industry for years to come.

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