The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Nov. 28, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Hsin-Hsiang Tseng, Changhua County, TW;
Chih-Fei Lee, Tainan, TW;
Chia-Pin Cheng, Kaohsiung, TW;
Fu-Cheng Chang, Tainan, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0216 (2014.01); H01L 31/0232 (2014.01); H01L 27/146 (2006.01); H01L 31/112 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02162 (2013.01); H01L 27/14643 (2013.01); H01L 27/14683 (2013.01); H01L 31/0232 (2013.01); H01L 31/1125 (2013.01); Y02E 10/50 (2013.01); Y02P 70/50 (2015.11);
Abstract
A semiconductor device includes a substrate, a photo sensing region, and a plurality of semiconductor plugs. The photo sensing region is in the substrate. The photo sensing region forms a p-n junction with the substrate. The semiconductor plugs extend from above the photo sensing region into the photo sensing region.