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For the Inventor, By the Inventor

Maxhuette-Haidhof, Germany

Florian Brandl

This inventor holds 12 USPTO granted patents and 2 published patent applications. Top assignee: Infineon Technologies Ag. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Florian Brandl. Retrieved from https://idiyas.com/inventor/florian-brandl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Wolnzach, DE (2019 - 2021)
  • Maxhütte-Haidhof, DE (2020 - 2022)

Company Filing History:

goldMedal12 out of 15,023 
 
Infineon Technologies Ag
 patents

Years Active: 2019-2026

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12 patents (USPTO):Explore Patents
1. 12535374 - Sensor for parallel measurement of pressure and acceleration and use of the sensor in a vehicle battery (2026-01-27),
2. 12498285 - Differential gas sensor with two sensor components and use for detection of gases (2025-12-16),
3. 12436050 - Pressure sensors and method for forming a MEMS pressure sensor (2025-10-07),
4. 12195325 - MEMS devices with support structures and associated production methods (2025-01-14),
5. 11505450 - Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package (2022-11-22),
6. 11247895 - Segmented stress decoupling via frontside trenching (2022-02-15),
7. 10996125 - Pressure sensors and method for forming a MEMS pressure sensor (2021-05-04),
8. 10899604 - Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package (2021-01-26),
9. 10858245 - Deposition of protective material at wafer level in front end for early stage particle and moisture protection (2020-12-08),
10. 10843916 - Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-filling (2020-11-24),
11. 10807862 - Segmented stress decoupling via frontside trenching (2020-10-20),
12. 10370244 - Deposition of protective material at wafer level in front end for early stage particle and moisture protection (2019-08-06),

Title: Florian Brandl - Innovative Inventor from Maxhütte-Haidhof

Introduction: Florian Brandl is a renowned inventor hailing from Maxhütte-Haidhof, Germany, known for his groundbreaking contributions to various fields.

Latest Patents: Florian Brandl holds several patents in the areas of renewable energy, sustainable technologies, and advanced manufacturing processes.

Career Highlights: With a career spanning over two decades, Florian Brandl has worked with leading research institutions and companies to develop cutting-edge solutions that have revolutionized industries.

Collaborations: Throughout his career, Florian Brandl has collaborated with top engineers, scientists, and designers to bring his innovative ideas to life, resulting in successful products and technologies.

Conclusion: Florian Brandl's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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