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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10370244 B1

PDFFull Text
Date of Patent:
Aug. 06, 2019

Filed:

Nov. 30, 2017

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Florian Brandl, Wolnzach, DE;

Manfred Fries, Hunderdorf, DE;

Franz-Peter Kalz, Regensburg, DE;

Assignee:

Infineon Technologies AG, , DE;

Attorney:

Design IP

Primary Examiner:

David Vu

Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 21/50 (2006.01); B29C 35/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00285 (2013.01); B81B 7/0029 (2013.01); B81B 7/0038 (2013.01); B81B 7/0045 (2013.01); B81B 7/0051 (2013.01); B81C 1/0019 (2013.01); B81C 1/0038 (2013.01); B81C 1/00063 (2013.01); B81C 1/00301 (2013.01); B81C 1/00904 (2013.01); H01L 21/50 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); B29C 35/02 (2013.01); H01L 2924/16235 (2013.01);
Abstract

A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

Find Patent Forward Citations

Brandl, Florian. (2019). Deposition of protective material at wafer level in front end for early stage particle and moisture protection (U.S. Patent No. 10370244). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10370244

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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