Company Filing History:

17 out of 164,108

International Business Machines Corporation

Years Active: 2009-2018

where 'Filed Patents' based on already Granted Patents

21 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10163697 - Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion (2018-12-25),

2. 9673091 - Structure for BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion (2017-06-06),

3. 9284185 - Integrated circuit switches, design structure and methods of fabricating the same (2016-03-15),

4. 9275951 - Curvilinear wiring structure to reduce areas of high field density in an integrated circuit (2016-03-01),

5. 8975531 - Composite copper wire interconnect structures and methods of forming (2015-03-10),

6. 8969195 - Methods of manufacturing semiconductor devices and a semiconductor structure (2015-03-03),

7. 8927411 - System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme (2015-01-06),

8. 8921975 - System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme (2014-12-30),

9. 8878315 - Horizontal coplanar switches and methods of manufacture (2014-11-04),

10. 8791778 - Vertical integrated circuit switches, design structure and methods of fabricating same (2014-07-29),

11. 8604898 - Vertical integrated circuit switches, design structure and methods of fabricating same (2013-12-10),

12. 8569091 - Integrated circuit switches, design structure and methods of fabricating the same (2013-10-29),

13. 8535966 - Horizontal coplanar switches and methods of manufacture (2013-09-17),

14. 8530970 - Curvilinear wiring structure to reduce areas of high field density in an integrated circuit (2013-09-10),

15. 8518817 - Method of electrolytic plating and semiconductor device fabrication (2013-08-27),

Title: Innovator Spotlight: Felix Patrick Anderson - Pioneering in BEOL Metal Levels

Introduction:

Felix Patrick Anderson, a distinguished inventor based in Colchester, VT, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 21 patents, Anderson's innovative approach to forming back end of the line (BEOL) metal levels has garnered recognition across the industry.

Latest Patents:

- Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion

- Structure for BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion

Career Highlights:

Anderson's expertise in developing methods for enhancing dielectric capping layer to metal wire adhesion in BEOL metal levels has been instrumental in advancing semiconductor manufacturing processes. His dedication to optimizing the performance and reliability of integrated circuits (IC) chips showcases his commitment to technological innovation.

Collaborations:

Throughout his career, Anderson has collaborated with esteemed professionals in the industry, including Anthony K Stamper and Thomas L McDevitt. His work with companies like IBM (International Business Machines Corporation) and Globalfoundries Inc. has further solidified his reputation as a trailblazer in semiconductor technology.

Conclusion:

Felix Patrick Anderson's prolific career in semiconductor innovation stands as a testament to his unwavering dedication to pushing the boundaries of BEOL metal levels. His patented methods for improving dielectric to metal adhesion reflect his passion for advancing the field, paving the way for groundbreaking advancements in semiconductor manufacturing.

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