The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Jun. 05, 2012
Applicants:

Felix P. Anderson, Colchester, VT (US);

Timothy H. Daubenspeck, Colchester, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Timothy S. Hayes, Colchester, VT (US);

Donald R. Letourneau, Winooski, VT (US);

Thomas L. Mcdevitt, Underhill, VT (US);

Anthony K. Stamper, Williston, VT (US);

Inventors:

Felix P. Anderson, Colchester, VT (US);

Timothy H. Daubenspeck, Colchester, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Timothy S. Hayes, Colchester, VT (US);

Donald R. Letourneau, Winooski, VT (US);

Thomas L. McDevitt, Underhill, VT (US);

Anthony K. Stamper, Williston, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76892 (2013.01); H01L 21/76838 (2013.01); H01L 23/5256 (2013.01);
Abstract

A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer deposited over the last metal interconnect layer and the at least two discrete metal conductors, a thin wire aluminum fuse connecting the at least two discrete metal conductors, and a fuse opening above the aluminum fuse.


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