Colchester, VT, United States of America

Timothy S Hayes

USPTO Granted Patents = 7 

Average Co-Inventor Count = 1.8

ph-index = 4

Forward Citations = 35(Granted Patents)


Location History:

  • Hinesburg, VT (US) (2004)
  • Hingesburg, VT (US) (2004)
  • Milton, VT (US) (2005)
  • Colchester, VT (US) (2005 - 2015)
  • Lakewood, OH (US) (2019)

Company Filing History:


Years Active: 2004-2019

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7 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Timothy S. Hayes

Introduction: Timothy S. Hayes, an accomplished inventor based in Colchester, Vermont, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of six patents, Hayes is known for his innovative approaches to integrating aluminum fuses within copper back-end-of-line (BEOL) interconnect schemes.

Latest Patents: Among his latest patents, Hayes has developed a groundbreaking system and method for forming an aluminum fuse for compatibility with copper BEOL interconnect schemes. This patent details a semiconductor fuse device that includes a last metal interconnect layer made of at least two discrete metal conductors, an inter-level dielectric layer, and a thin wire aluminum fuse that connects these conductors. A fuse opening is strategically positioned above the aluminum fuse to enhance functionality and efficiency. His work exemplifies a keen understanding of contemporary challenges in semiconductor design and manufacturing.

Career Highlights: Timothy S. Hayes currently works at International Business Machines Corporation (IBM), where his expertise in semiconductor technology plays a pivotal role in advancing their infrastructure. His innovative spirit and technical knowledge have propelled him to the forefront of his field, making him a valued asset to his team and the company at large.

Collaborations: Throughout his career, Hayes has collaborated with esteemed colleagues such as Felix Patrick Anderson and Timothy Harrison Daubenspeck. These collaborations have not only enhanced his inventions but have also contributed to the collective advancement of technologies within IBM.

Conclusion: With a total of six patents to his name, Timothy S. Hayes exemplifies the innovative spirit necessary for driving advancements in semiconductor technology. His contributions, particularly in developing reliable aluminum fuse systems for copper interconnect schemes, position him as a noteworthy figure in the field. As the technology landscape continues to evolve, Hayes' work will undoubtedly play a significant role in shaping future innovations.

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