The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Jul. 18, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Felix Patrick Anderson, Colchester, VT (US);

Thomas Leddy McDevitt, Underhill, VT (US);

Anthony Kendall Stamper, Williston, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/528 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/33 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01G 4/232 (2013.01); H01G 4/306 (2013.01); H01G 4/33 (2013.01); H01L 21/768 (2013.01); H01L 23/5223 (2013.01); H01L 28/86 (2013.01); H01L 28/90 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49204 (2015.01);
Abstract

A method for reducing areas of high field density in an integrated circuit is disclosed. In one embodiment, the method includes forming a first curvilinear wiring structure in a first interconnect layer of an integrated circuit. A second curvilinear wiring structure may be formed in a second interconnect layer of the integrated circuit, such that the first and second curvilinear wiring structures are substantially vertically aligned. The first curvilinear wiring structure may then be electrically connected to the second curvilinear wiring structure. A corresponding apparatus and design structure are also described.


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