The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Sep. 22, 2010
Felix P. Anderson, Colchester, VT (US);
Zhong-xiang He, Essex Junction, VT (US);
Anthony K. Stamper, Williston, VT (US);
Eric J. White, Charlotte, VT (US);
Felix P. Anderson, Colchester, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Anthony K. Stamper, Williston, VT (US);
Eric J. White, Charlotte, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The disclosure relates generally to semiconductor device fabrication, and more particularly to methods of electroplating used in semiconductor device fabrication. A method of electroplating includes: immersing an in-process substrate into an electrolytic plating solution to form a first metal layer on the in-process substrate; then performing a first chemical-mechanical polish to a liner on the in-process substrate followed by immersing the in-process substrate into the electrolytic plating solution to form a second metal layer on the first metal layer and the liner; and performing a second chemical-mechanical polish to the liner.