Company Filing History:

5 out of 12,867

Advanced Micro Devices Corporation

patents

4 out of 1,853

Adeia Semiconductor Bonding Technologies Inc.

patents

2 out of 20,333

Cisco Technology, Inc.

Procket Networks, Inc.

patents

Years Active: 2002-2018

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10008652 - Light emitting diode device with reconstituted LED components on substrate (2018-06-26),

2. 9620436 - Light emitting diode device with reconstituted LED components on substrate (2017-04-11),

3. 9524883 - Holding of interposers and other microelectronic workpieces in position during assembly and other processing (2016-12-20),

4. 9496154 - Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias (2016-11-15),

5. 8405187 - Chip package with channel stiffener frame (2013-03-26),

6. 8008133 - Chip package with channel stiffener frame (2011-08-30),

7. 7243327 - Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package (2007-07-10),

8. 7055122 - Method for automatically connecting top side conductors with bottom side conductors of an integrated circuit package (2006-05-30),

9. 6976236 - Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package (2005-12-13),

10. 6538320 - Heat spreader having holes for rivet-like adhesive connections (2003-03-25),

11. 6512675 - Heat sink grounded to a grounded package lid (2003-01-28),

12. 6508845 - Method and apparatus for precoining BGA type packages prior to electrical characterization (2003-01-21),

13. 6483169 - Extruded heat spreader (2002-11-19),

14. 6399474 - Method and apparatus for precoining BGA type packages prior to electrical characterization (2002-06-04),

Title: Eric Tosaya: Innovator in Light Emitting Diode Technologies

Introduction

Eric Tosaya, an accomplished inventor based in Fremont, CA, is known for his significant contributions to the field of light emitting diode (LED) technologies. With a total of 14 patents to his name, Tosaya's innovations are paving the way for advancements in optically coherent LED devices.

Latest Patents

One of his most recent patents focuses on a “Light emitting diode device with reconstituted LED components on substrate.” This innovative concept involves the formation of a plurality of known good die (KGD) LED components into larger optically coherent LED chips or devices. The technical details highlight that this innovation aims to enhance the efficiency and performance of LED technologies in various applications.

Career Highlights

Throughout his career, Eric has been a part of several notable organizations that have played a crucial role in his development as an inventor. He has worked for Advanced Micro Devices Corporation and Adeia Semiconductor Bonding Technologies Inc., where he contributed to their advancements in semiconductor technologies.

Collaborations

In the journey of his career, Eric has had the opportunity to collaborate with skilled professionals such as Tom Ley and Alex Tain. Their teamwork has likely contributed to the successful development and implementation of innovative technologies in the semiconductor and LED fields.

Conclusion

Eric Tosaya's work exemplifies the spirit of innovation in technology, particularly in the realm of light emitting diodes. With multiple patents and a strong career background, he continues to push the boundaries of what is possible in LED technology, ensuring that advancements will keep coming for future applications.

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