The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Sep. 16, 2014
Invensas Corporation, San Jose, CA (US);
Eric S. Tosaya, Fremont, CA (US);
Rajesh Katkar, San Jose, CA (US);
Liang Wang, Milpitas, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A microelectronic component () has a contact pad (C,C,C) recessed in a cavity () and covered by underfill tape (). The cavity has a void (V) below the underfill tape. A protruding contact pad of another microelectronic component ruptures the underfill tape to enter the cavity and bond to the recessed contact pad. The void helps in rupturing the underfill tape, thus reducing the amount of underfill residue between the two contact pads and improving the contact resistance. Also provided is a microelectronic component having a substrate with a cavity and having a through-substrate via extending into the cavity. Other features are also provided.