Eric R Miller

This inventor holds 11 USPTO granted patents and 8 published patent applications, plus 1 CIPO patent and 2 EPO patents. Top assignee: Raytheon Company. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eric R Miller. Retrieved from https://idiyas.com/inventor/eric-r-miller-p0gn1kkj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 (Patent Applications = 8)

% Patents Active = 100.0

CIPO Patents = 1 (Patent Applications = 3)

EPO Patents = 2 (Patent Applications = 3)

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 4(Granted Patents)

Location History:

Waltham, MA (US) (2019 - 2022)
Lompoc, CA (US) (2019 - 2023)
Orcutt, CA (US) (2022 - 2023)

Company Filing History:

11 out of 8,319

Raytheon Company

patents

Years Active: 2019-2025

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12305310 - Indium electroplating on physical vapor deposition tantalum (2025-05-20),

2. 12148721 - Iterative formation of damascene interconnects (2024-11-19),

3. 11837623 - Integrated circuit having vertical routing to bond pads (2023-12-05),

4. 11753736 - Indium electroplating on physical vapor deposition tantalum (2023-09-12),

5. 11710756 - Integrating optical elements with electro-optical sensors via direct-bond hybridization (2023-07-25),

6. 11430753 - Iterative formation of damascene interconnects (2022-08-30),

7. 11393869 - Wafer level shim processing (2022-07-19),

8. 11222813 - Method of manufacturing wafer level low melting temperature interconnections (2022-01-11),

9. 10847569 - Wafer level shim processing (2020-11-24),

10. 10515837 - Method of wafer bonding of dissimilar thickness die (2019-12-24),

11. 10504777 - Method of manufacturing wafer level low melting temperature interconnections (2019-12-10),

Title: Eric R Miller: Innovator in Semiconductor Technology

Introduction

Eric R Miller is a prominent inventor based in Waltham, MA (US), known for his significant contributions to semiconductor technology. He holds a total of 11 patents, showcasing his expertise and innovative spirit in the field.

Latest Patents

Among his latest patents is the invention titled "Indium electroplating on physical vapor deposition tantalum." This patent describes a method for producing a wafer stack that includes a substrate, a tantalum-nitride film, a tantalum layer, and indium deposited on the tantalum layer. The invention allows for various thickness relationships between the tantalum layer and the tantalum-nitride film, enhancing the production of the wafer stack. Another notable patent is "Iterative formation of damascene interconnects," which outlines methods for fabricating interconnects. This method involves depositing a conformal layer of a plating base in multiple vias, followed by the deposition of a photoresist and plating metal. The process includes chemical mechanical planarization (CMP) and metrology to ensure the quality of the vias.

Career Highlights

Eric R Miller is currently employed at Raytheon Company, where he continues to push the boundaries of innovation in semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices.

Collaborations

Throughout his career, Eric has collaborated with notable colleagues, including Sean P Kilcoyne and Michael J Rondon. These collaborations have contributed to the development of cutting-edge technologies in their field.

Conclusion

Eric R Miller's contributions to semiconductor technology through his patents and work at Raytheon Company highlight his role as a leading innovator. His inventions continue to impact the industry and pave the way for future advancements.

Profile summary based on public USPTO records.