The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Jul. 08, 2020
Raytheon Company, Waltham, MA (US);
Eric R. Miller, Orcutt, CA (US);
Sean P. Kilcoyne, Lompoc, CA (US);
Michael V. Liguori, Buellton, CA (US);
Michael J. Rondon, Santa Rosa, CA (US);
RAYTHEON COMPANY, Waltham, MA (US);
Abstract
Disclosed herein are interconnects and methods of fabricating a plurality of interconnects. The method includes depositing a conformal layer of a plating base in each of a plurality of vias, and depositing a photoresist on two portions of a surface of the plating base outside and above the plurality of vias. The method also includes depositing a plating metal over the plating base in each of the plurality of vias, the depositing resulting in each of the plurality of vias being completely filled or incompletely filled, performing a chemical mechanical planarization (CMP), and performing metrology to determine if any of the plurality of vias is incompletely filled following the depositing the plating metal. A second iteration of the depositing the plating metal over the plating base is performed in each of the plurality of vias based on determining that at least one of the plurality of vias is incompletely filled.