Santa Rosa, CA, United States of America

Michael J Rondon



 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2019-2025

Loading Chart...
Loading Chart...
Loading Chart...
8 patents (USPTO):Explore Patents

Title: Innovations of Michael J Rondon

Introduction

Michael J Rondon is a prominent inventor based in Santa Rosa, CA. He has made significant contributions to the field of technology, holding a total of 8 patents. His work primarily focuses on advancements in electroplating and interconnect fabrication.

Latest Patents

One of his latest patents is titled "Indium electroplating on physical vapor deposition tantalum." This innovation describes a method for producing a wafer stack that includes a substrate, a tantalum-nitride film, a tantalum layer, and indium deposited on the tantalum layer. The patent outlines various relationships of thicknesses between the tantalum layer and the tantalum-nitride film that can be utilized in the production of the wafer stack. Another notable patent is "Iterative formation of damascene interconnects." This patent details methods for fabricating a plurality of interconnects, including the deposition of a conformal layer of a plating base in multiple vias and the use of chemical mechanical planarization (CMP) to ensure proper filling of the vias.

Career Highlights

Michael J Rondon is currently employed at Raytheon Company, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic components and systems.

Collaborations

Throughout his career, Rondon has collaborated with notable colleagues, including Eric R Miller and Andrew Peter Clarke. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Michael J Rondon's contributions to the field of technology through his patents and collaborations highlight his role as a leading inventor. His work continues to influence advancements in electroplating and interconnect fabrication.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…