The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Feb. 13, 2018
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Sean P. Kilcoyne, Waltham, MA (US);
Eric R. Miller, Waltham, MA (US);
George Grama, Waltham, MA (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/56 (2006.01); H05K 3/42 (2006.01); C23C 18/16 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7684 (2013.01); C23C 18/168 (2013.01); C23C 18/1653 (2013.01); C25D 7/123 (2013.01); H01L 21/568 (2013.01); H01L 21/76873 (2013.01); H01L 23/3121 (2013.01); H01L 23/5283 (2013.01); H05K 3/424 (2013.01); H01L 2221/1089 (2013.01);
Abstract
A method of manufacturing an array of planar wafer level metal posts includes plating an array of posts within a photoresist (PR) pattern mold on a substrate of a first wafer. Stripping the PR pattern mold from the substrate and array of posts. Applying an oxide layer, at a temperature of below 150 degrees Celsius, over a surface of the first wafer. Applying chemical-mechanical polishing (CMP) to planarize the oxide layer and the array of posts.