The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Nov. 19, 2020
Raytheon Company, Waltham, MA (US);
Jamal I. Mustafa, Goleta, CA (US);
Robert C. Anderson, Santa Barbara, CA (US);
John L. Vampola, Santa Barbara, CA (US);
Sean P. Kilcoyne, Lompoc, CA (US);
Eric R. Miller, Orcutt, CA (US);
George Grama, Orcutt, CA (US);
RAYTHEON COMPANY, Waltham, MA (US);
Abstract
A direct-bond hybridization (DBH) method is provided to assemble a sensor wafer device. The DBH method includes fabricating an optical element on a handle wafer and depositing first oxide with n-x thickness on the optical element where n is an expected final oxide thickness of the sensor wafer, depositing second oxide with x thickness onto a sensor wafer, executing layer transfer of the optical element by a DBH fusion bond technique to the sensor wafer whereby the first and second oxides form an oxide layer of n thickness between the optical element and the sensor wafer and removing the handle wafer.