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For the Inventor, By the Inventor

Bend, OR, United States of America

Dylan Murdock

USPTO Granted Patents = 14 

Average Co-Inventor Count = 1.4

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Allen, TX (US) (2018)
  • Bend, OR (US) (2018 - 2024)

Company Filing History:

goldMedal14 out of 1,126 
 
Qorvo Us, Inc.
 patents

Years Active: 2018-2025

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14 patents (USPTO):Explore Patents
1. 12266582 - Hermetic package for high CTE mismatch (2025-04-01),
2. 12119281 - Hermetic package for high CTE mismatch (2024-10-15),
3. 11955687 - Structural arrangements for spatial power-combining devices (2024-04-09),
4. 11791251 - High power laminate RF package (2023-10-17),
5. 11665867 - Thermal structures for heat transfer devices and spatial power-combining devices (2023-05-30),
6. 11621469 - Power-combining devices with increased output power (2023-04-04),
7. 11564337 - Thermal structures for heat transfer devices and spatial power-combining devices (2023-01-24),
8. 11255608 - Heat exchanger assemblies for electronic devices (2022-02-22),
9. 11162734 - Heat exchanger assemblies for electronic devices and related methods (2021-11-02),
10. 10855240 - Structures for spatial power-combining devices (2020-12-01),
11. 10539371 - Heat transfer device incorporating a helical flow element within a fluid conduit (2020-01-21),
12. 10418257 - Environmentally robust plating configuration for metal-diamond composites substrate (2019-09-17),
13. 10015882 - Modular semiconductor package (2018-07-03),
14. 9911678 - Substrate with integrated heat spreader (2018-03-06),

Title: Innovations of Dylan Murdock

Introduction

Dylan Murdock is a prominent inventor based in Bend, Oregon. He has made significant contributions to the field of technology, holding a total of 14 patents. His work primarily focuses on developing innovative solutions that address complex engineering challenges.

Latest Patents

One of Dylan's latest patents is a hermetic package designed for high coefficient of thermal expansion (CTE) mismatch configurations. This innovative hermetic package includes a metal base and multiple discrete segments. A gap exists between every two adjacent ceramic wall segments, which is sealed with a connecting material. The ceramic wall segments, along with the connecting material, form a ring wall. The design ensures that the gap between adjacent ceramic wall segments is strategically located at the corners of the ring wall. The metal base can either be surrounded by the ring wall or positioned underneath it.

Career Highlights

Dylan Murdock has established himself as a key figure in his field through his inventive work at Qorvo US, Inc. His expertise in creating advanced packaging solutions has garnered attention and respect within the industry.

Collaborations

Dylan has collaborated with notable colleagues, including Gregory Valenti and Eric Jackson. Their combined efforts have contributed to the success of various projects and innovations.

Conclusion

Dylan Murdock's contributions to technology through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to push the boundaries of engineering and technology.

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