The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Jul. 24, 2018
Applicant:
Qorvo Us, Inc., Greensboro, NC (US);
Inventor:
Dylan Murdock, Bend, OR (US);
Assignee:
Qorvo US, Inc., Greensboro, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4871 (2013.01); H01L 23/142 (2013.01); H01L 23/3732 (2013.01); H01L 23/3735 (2013.01);
Abstract
The present disclosure relates to a substrate with a plating configuration and a process for making the same. The disclosed substrate includes a substrate base with a substrate body, and a plating configuration with a plating seed layer and a plating barrier layer. Herein, the substrate body is formed of metal-diamond composites. The plating seed layer is formed of copper, silver, or gold, and the plating barrier layer includes nickel material. The plating seed layer directly covers at least sidewalls of the substrate body, and the plating barrier layer is directly formed over the plating seed layer and encloses the substrate base.