Growing community of inventors

Bend, OR, United States of America

Dylan Murdock

Average Co-Inventor Count = 1.44

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 7

Dylan MurdockEric Jackson (4 patents)Dylan MurdockGregory Valenti (3 patents)Dylan MurdockChristo Pavel Bojkov (1 patent)Dylan MurdockRobert Charles Dry (1 patent)Dylan MurdockJohn Kitt (1 patent)Dylan MurdockWalid M Meliane (1 patent)Dylan MurdockMichael Arnold (1 patent)Dylan MurdockBinh K Le (1 patent)Dylan MurdockDylan Murdock (15 patents)Eric JacksonEric Jackson (5 patents)Gregory ValentiGregory Valenti (4 patents)Christo Pavel BojkovChristo Pavel Bojkov (14 patents)Robert Charles DryRobert Charles Dry (13 patents)John KittJohn Kitt (10 patents)Walid M MelianeWalid M Meliane (7 patents)Michael ArnoldMichael Arnold (2 patents)Binh K LeBinh K Le (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Qorvo US, Inc. (15 from 1,139 patents)


15 patents:

1. 12525696 - Structural arrangements for spatial power-combining devices

2. 12266582 - Hermetic package for high CTE mismatch

3. 12119281 - Hermetic package for high CTE mismatch

4. 11955687 - Structural arrangements for spatial power-combining devices

5. 11791251 - High power laminate RF package

6. 11665867 - Thermal structures for heat transfer devices and spatial power-combining devices

7. 11621469 - Power-combining devices with increased output power

8. 11564337 - Thermal structures for heat transfer devices and spatial power-combining devices

9. 11255608 - Heat exchanger assemblies for electronic devices

10. 11162734 - Heat exchanger assemblies for electronic devices and related methods

11. 10855240 - Structures for spatial power-combining devices

12. 10539371 - Heat transfer device incorporating a helical flow element within a fluid conduit

13. 10418257 - Environmentally robust plating configuration for metal-diamond composites substrate

14. 10015882 - Modular semiconductor package

15. 9911678 - Substrate with integrated heat spreader

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as of
1/18/2026
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