The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Aug. 04, 2021
Applicant:
Qorvo Us, Inc., Greensboro, NC (US);
Inventor:
Dylan Murdock, Bend, OR (US);
Assignee:
Qorvo US, Inc., Greensboro, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/29 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/291 (2013.01); H01L 23/315 (2013.01); H01L 23/481 (2013.01); H01L 23/3736 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49176 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01403 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15763 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/16747 (2013.01); H01L 2924/1676 (2013.01); H01L 2924/173 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/1776 (2013.01); H01L 2924/3512 (2013.01);
Abstract
The present disclosure relates to a hermetic package capable of handling a high coefficient of thermal expansion (CTE) mismatch configuration. The disclosed hermetic package includes a metal base and multiple segments that are discrete from each other. Herein, a gap exists between every two adjacent ceramic wall segments and is sealed with a connecting material. The ceramic wall segments with the connecting material form a ring wall, where the gap between every two adjacent ceramic wall segments is located at a corner of the ring wall. The metal base is either surrounded by the ring wall or underneath the ring wall.