The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Jul. 29, 2021
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventor:

Dylan Murdock, Bend, OR (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01L 23/057 (2006.01); H01L 23/00 (2006.01); H01L 23/047 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H01L 23/047 (2013.01); H01L 23/057 (2013.01); H01L 23/3735 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/48155 (2013.01); H01L 2224/73265 (2013.01);
Abstract

The present disclosure relates to a package capable of handling high radio frequency (RF) power, which includes a carrier, a ring structure attached to a top surface of the carrier, an RF die attached to the top surface of the carrier within an opening of the ring structure and electrically connected to the ring structure, a heat spreader attached to a top surface of the ring structure, and an output signal lead configured to send out RF output signals generated by the RF die. Herein, the heat spreader covers a portion of the top surface of the ring structure at an output side of the package, and the output signal lead is attached to a top surface of the heat spreader. As such, the RF output signals are capable of being transmitted from the RF die to the output signal lead through the ring structure and the heat spreader.


Find Patent Forward Citations

Loading…