The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Jan. 05, 2015
Applicant:

Triquint Semiconductor, Inc., Hillsboro, OR (US);

Inventors:

Dylan Murdock, Allen, TX (US);

Binh K. Le, Frisco, TX (US);

Michael J. Arnold, Westminster, TX (US);

Walid Meliane, Frisco, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H05K 5/06 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 3/306 (2013.01); H05K 3/3447 (2013.01); H05K 5/0095 (2013.01); H05K 5/0239 (2013.01); H05K 5/061 (2013.01); H05K 5/069 (2013.01);
Abstract

Embodiments described herein relate generally to a microelectronic packaging and the manufacture thereof. A carrier may have a die attached to a top face thereof. A printed circuit board may be attached to the top face of the carrier. The printed circuit board may have a hole in which the die is disposed. A lid may be attached to the printed circuit board opposite the carrier so that the die is enclosed by the carrier, the printed circuit board, and the lid. The printed circuit board may form a seal ring around the die. Other embodiments may be described and/or claimed.


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