Binh K Le

Title: Binh K Le: Innovator in Microelectronic Packaging

Introduction

Binh K Le is a notable inventor based in Frisco, TX (US). He has made significant contributions to the field of microelectronics, particularly in the area of semiconductor packaging. His innovative approach has led to the development of a unique patent that enhances the efficiency and functionality of microelectronic devices.

Latest Patents

Binh K Le holds a patent for a Modular Semiconductor Package. This invention relates to microelectronic packaging and its manufacturing process. The design features a carrier with a die attached to its top face, along with a printed circuit board that is also affixed to the carrier. The printed circuit board includes a hole that accommodates the die, while a lid is secured to the printed circuit board, enclosing the die within the assembly. This configuration allows for a seal ring to be formed around the die, ensuring its protection and functionality.

Career Highlights

Binh K Le is currently employed at Qorvo US, Inc., where he continues to innovate in the field of microelectronics. His work has been instrumental in advancing the technology used in semiconductor packaging, making it more efficient and reliable.

Collaborations

Binh has collaborated with talented coworkers such as Dylan Murdock and Michael Arnold. Their combined expertise contributes to the innovative environment at Qorvo US, Inc.

Conclusion

Binh K Le's contributions to microelectronic packaging through his patent demonstrate his commitment to innovation in the field. His work not only enhances the functionality of semiconductor devices but also showcases the importance of collaboration in technological advancements.