Douglas M Trickett

Title: Douglas M Trickett: Innovator in Chamferless Via Structures

Introduction

Douglas M Trickett is a notable inventor based in Altamont, NY (US). He holds a total of 16 patents, showcasing his significant contributions to the field of technology and manufacturing. His innovative work primarily focuses on chamferless via structures, which have applications in advanced electronic devices.

Latest Patents

Trickett's latest patents include methods for manufacturing chamferless via structures. One of the methods involves forming at least one self-aligned via within dielectric material, followed by plugging the via with material. A protective sacrificial mask is then formed over the plugged material after a recessing process. The method continues with the formation of at least one trench within the dielectric material, where the protective mask safeguards the material during trench formation. Finally, the protective mask and the material within the self-aligned via are removed to create a wiring via, which is then filled with conductive material. Another patent details a similar process for non-self-aligned vias, emphasizing the versatility of Trickett's innovations.

Career Highlights

Throughout his career, Douglas M Trickett has worked with prominent companies such as IBM and Globalfoundries Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor industry.

Collaborations

Trickett has collaborated with notable individuals in his field, including Frank Wilhelm Mont and Brown Cornelius Peethala. These partnerships have likely enhanced his innovative capabilities and broadened the impact of his work.

Conclusion

Douglas M Trickett's contributions to chamferless via structures and his extensive patent portfolio highlight his role as a significant innovator in the technology sector. His work continues to influence advancements in electronic manufacturing.