Livermore, CA, United States of America

Douglas Buchberger

This inventor holds 35 USPTO granted patents and 1 published patent application, primarily in Plasma Processing. Top assignees: Applied Materials, Inc., Other. Active years: 1997-2026.

USPTO Granted Patents = 35 

% Patents Active = 88.6

Average Co-Inventor Count = 5.4

ph-index = 18

Forward Citations = 1,845(Granted Patents)


Location History:

  • Pleasanton, CA (US) (2000 - 2002)
  • Tracy, CA (US) (1997 - 2004)
  • Livermore, CA (US) (2009 - 2022)

Company Filing History:


Years Active: 1997-2026

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Areas of Expertise:
Ion Beam Etch
Pulsed Plasma
Plasma Reactor
Temperature Control
Gas Flow Management
Electrostatic Chuck
Thermal Control
Inductive Antenna
Polymer-Hardening
Symmetrical Feed Structure
Wafer Processing
Plasma Conductance
35 patents (USPTO):Explore Patents

Title: Innovations by Douglas Buchberger: Pioneering Advances in Ion Beam Etching and Plasma Processing

Introduction: Douglas Buchberger, an accomplished inventor based in Livermore, California, holds an impressive portfolio of 34 patents. His contributions to the field of materials processing, particularly in ion beam etching and plasma deposition methods, have propelled advancements in various technological applications.

Latest Patents: Among his latest innovations, Buchberger has developed a Multi-source Ion Beam Etch System, which includes an apparatus for a multi-source ion beam etching (IBE) system. The system features a multi-source lid comprising a multi-source adaptor and a lower chamber adaptor. Additionally, it incorporates a multitude of IBE sources coupled to the multi-source adaptor, alongside a rotary shield assembly that operates via a shield motor mechanism designed to rotate the rotary shield. This innovative design includes a body with an IBE source opening and beam conduits for efficient etching processes.

In another notable patent, Buchberger introduced methods for Pulsed Plasma for Film Deposition. This method involves processing a substrate within a chamber by depositing a layer of material through the interaction of a first reactive species from a remote plasma source and a precursor. The technique includes treating the deposited materials by exposing them to plasma generated within the processing chamber, utilizing pulsed plasma sources to control deposition and treatment periods effectively.

Career Highlights: Throughout his career, Douglas Buchberger has made significant contributions to reputable companies such as Applied Materials, Inc. His work at these institutions has consistently focused on enhancing technology in the semiconductor and materials processing industries.

Collaborations: In his journey, Buchberger has collaborated with notable professionals, including Kenneth S. Collins and Michael Robert Rice. Their joint efforts have led to substantial advancements in technology and innovative solutions within their fields.

Conclusion: Douglas Buchberger stands out as a visionary inventor whose patents reflect a deep understanding of ion beam etching and plasma processing methodologies. His innovations not only highlight his technical expertise but also contribute to the ongoing evolution of materials science. With an impressive track record and ongoing dedication to innovation, Buchberger continues to be a significant force within the scientific community.

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