The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

May. 19, 2011
Applicants:

Fernando M. Silveira, Livermore, CA (US);

Hamid Tavassoli, Cupertino, CA (US);

Xiaoping Zhou, San Jose, CA (US);

Shane C. Nevil, Livermore, CA (US);

Douglas A. Buchberger, Livermore, CA (US);

Brad L. Mays, Findlay, OH (US);

Tina Tsong, San Jose, CA (US);

Chetan Mahadeswaraswamy, Sunnyvale, CA (US);

Yashaswini B. Pattar, Palo Alto, CA (US);

Duy D. Nguyen, Milpitas, CA (US);

Walter R. Merry, Sunnyvale, CA (US);

Inventors:

Fernando M. Silveira, Livermore, CA (US);

Hamid Tavassoli, Cupertino, CA (US);

Xiaoping Zhou, San Jose, CA (US);

Shane C. Nevil, Livermore, CA (US);

Douglas A. Buchberger, Livermore, CA (US);

Brad L. Mays, Findlay, OH (US);

Tina Tsong, San Jose, CA (US);

Chetan Mahadeswaraswamy, Sunnyvale, CA (US);

Yashaswini B. Pattar, Palo Alto, CA (US);

Duy D. Nguyen, Milpitas, CA (US);

Walter R. Merry, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 10/00 (2006.01); H01J 37/20 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/20 (2013.01); H01J 2237/2001 (2013.01); H01J 37/32724 (2013.01); H01J 37/32926 (2013.01); H01J 37/32908 (2013.01); H01J 37/32935 (2013.01);
Abstract

Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.


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