Findlay, OH, United States of America

Brad L Mays

This inventor holds 19 USPTO granted patents, primarily in Plasma Processing. Top assignees: Applied Materials, Inc., Other. Active years: 2002-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brad L Mays. Retrieved from https://idiyas.com/inventor/brad-l-mays

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 84.2

Average Co-Inventor Count = 5.2

ph-index = 5

Forward Citations = 360(Granted Patents)


Location History:

  • San Jose, CA (US) (2002 - 2020)
  • Findlay, OH (US) (2014 - 2023)

Company Filing History:


Years Active: 2002-2023

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Areas of Expertise:
Electrostatic Chuck
Thermal Control
Plasma Processing
Wafer Temperature
Dynamic Voltage Sweeping
Thermal Fluid Delivery
Temperature Drift Correction
Heat Exchanger
Substrate Carrier
Pulsed Heat Transfer
Backside Plasma Ignition
Thermal Expansion Compensation
19 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Brad L. Mays

Introduction

Brad L. Mays, an accomplished inventor located in Findlay, OH, has made significant strides in the field of innovation with a remarkable portfolio of 19 patents. His work primarily focuses on advancements in thermal management systems for substrate carriers, showcasing his commitment to enhancing operational efficiency in various applications.

Latest Patents

Among Brad's latest patents is a breakthrough design for a substrate carrier using a proportional thermal fluid delivery system. This innovative apparatus incorporates a heat exchanger to regulate the thermal fluid's temperature within the carrier, optimizing substrate processing. The proportional valve and temperature controller work in tandem to ensure precise temperature adjustments, highlighting the system's efficiency.

Another noteworthy patent is the electrostatic chuck featuring thermally isolated zones with minimal crosstalk. This substrate support assembly integrates a ceramic puck and a thermally conductive base that includes multiple thermal zones. The design ensures effective thermal management through variably conductive materials and thermal isolators, enhancing the functionality of the substrate carrier.

Career Highlights

Brad has worked with notable companies, including Applied Materials, Inc., where he contributed to innovative projects and products in the semiconductor industry. His extensive experience in leading-edge technologies has shaped his approach to thermal management solutions.

Collaborations

Throughout his career, Brad has collaborated with talented colleagues such as Hamid Noorbakhsh and Sergio Fukuda Shoji. These professional partnerships have fostered a dynamic exchange of ideas, further fueling Brad's inventive spirit and enhancing his contributions to the field.

Conclusion

Brad L. Mays stands out as a prominent figure in the realm of innovation, making substantial contributions through his patents and collaborations. His expertise in thermal management and substrate processing continues to influence advancements in technology, establishing him as a key player in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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