The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Feb. 26, 2007
Ezra Robert Gold, Sunnyvale, CA (US);
Richard Charles Fovell, San Jose, CA (US);
James Patrick Cruse, Capitola, CA (US);
Jared Ahmad Lee, Santa Clara, CA (US);
Bruno Geoffrion, Sunnyvale, CA (US);
Douglas Arthur Buchberger, Livermore, CA (US);
Martin J. Salinas, San Jose, CA (US);
Ezra Robert Gold, Sunnyvale, CA (US);
Richard Charles Fovell, San Jose, CA (US);
James Patrick Cruse, Capitola, CA (US);
Jared Ahmad Lee, Santa Clara, CA (US);
Bruno Geoffrion, Sunnyvale, CA (US);
Douglas Arthur Buchberger, Livermore, CA (US);
Martin J. Salinas, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method and apparatus for delivering gases to a semiconductor processing system are provided. In one embodiment, an apparatus for delivering gases to a semiconductor processing system includes a plurality of gas input and output lines having inlet and outlet ports. Connecting lines couple respective pairs of the gas input and gas output lines. Connecting valves are arranged to control flow through the respective connecting lines. Mass gas flow controllers are arranged to control flow into respective inlet ports. In another embodiment, a method includes providing a manifold having at least a plurality of inlet that may be selectively coupled to at least one of a plurality of outlets, flowing one or more gases through the manifold to a vacuum environment by-passing the processing chamber prior to processing or to a calibration circuit, and flowing the one or more gases into the processing chamber during substrate processing.