Hwaseong, South Korea

Dong-Chan Lim

This inventor holds 21 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Devices. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2008-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong-Chan Lim. Retrieved from https://idiyas.com/inventor/dong-chan-lim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 90.5


Average Co-Inventor Count = 6.0

ph-index = 4

Forward Citations = 45(Granted Patents)


Location History:

  • Seoul, KR (2008 - 2011)
  • Yongin-si, KR (2009 - 2011)
  • Hwaseong-si, KR (2020 - 2024)

Company Filing History:


Years Active: 2008-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Device
Integrated Circuit
Fabrication Method
Through Silicon Via
High-k Dielectric
Polymetal Gate Electrode
Ohmic Layer
Substrate Etching
Active Regions
Semiconductor Package
Silicon Chips
Gate Formation
21 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Dong-Chan Lim in Semiconductor Technology**

Introduction

Dong-Chan Lim is an accomplished inventor based in Hwaseong-si, South Korea, with an impressive portfolio of 20 patents. His contributions are particularly significant in the field of semiconductor technology, where he has developed innovative devices and packaging methods that enhance performance and efficiency.

Latest Patents

Among his latest patents, Lim has developed a semiconductor device which features a unique interlayer dielectric layer on a substrate. This device includes both a first and a second connection line, where the second connection line is designed with a width greater than the first. Notably, the second connection line is constructed with a multi-layer approach comprising a first metal layer, a barrier layer, and a second metal layer—each offering distinct properties to optimize function. Furthermore, Lim's patent concerning a semiconductor package involves stacking two semiconductor chips to create a highly efficient configuration. This includes sophisticated plug structures that enhance connectivity and ensure optimal performance.

Career Highlights

Dong-Chan Lim is a key figure at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor innovation. His work has made significant advancements in technologies that are essential for modern electronic devices. His expertise and commitment to innovation have earned him recognition within the industry.

Collaborations

Throughout his career, Lim has collaborated with notable colleagues, including Hee-Sook Park and Kwang-Jin Moon. Together, they have contributed to groundbreaking advancements in semiconductor technologies, demonstrating the power of teamwork in driving innovation forward.

Conclusion

Dong-Chan Lim's contributions to semiconductor technology through his extensive patent portfolio underscore his role as a leading inventor in the field. His innovative devices and packaging methods have paved the way for enhancements in the performance of electronic devices, solidifying his status as a pivotal figure at Samsung Electronics Co., Ltd. The impact of his work not only benefits the company but also shapes the future of semiconductor technology globally.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…