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For the Inventor, By the Inventor

St. Albans, VT, United States of America

Donald W Brouillette

USPTO Granted Patents = 17

Average Co-Inventor Count = 4.7

ph-index = 8

Forward Citations = 168(Granted Patents)


Location History:

  • Georgia, VT (US) (2000)
  • St. Albans, VT (US) (1999 - 2012)

Company Filing History:

goldMedal17 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1999-2012

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17 patents (USPTO):
1. 8163602 - Ultraviolet energy curable tape and method of making a semiconductor chip using the tape (2012-04-24),
2. 7902682 - Ultraviolet energy curable tape and method of making a semiconductor chip using the tape (2011-03-08),
3. 7288465 - Semiconductor wafer front side protection (2007-10-30),
4. 7134933 - Wafer thickness control during backside grind (2006-11-14),
5. 7074715 - Use of photoresist in substrate vias during backside grind (2006-07-11),
6. 7001827 - Semiconductor wafer front side protection (2006-02-21),
7. 6915795 - Method and system for dicing wafers, and semiconductor structures incorporating the products thereof (2005-07-12),
8. 6888223 - Use of photoresist in substrate vias during backside grind (2005-05-03),
9. 6887126 - Wafer thickness control during backside grind (2005-05-03),
10. 6600213 - Semiconductor structure and package including a chip having chamfered edges (2003-07-29),
11. 6368881 - Wafer thickness control during backside grind (2002-04-09),
12. 6328794 - Method of controlling stress in a film (2001-12-11),
13. 6271102 - Method and system for dicing wafers, and semiconductor structures incorporating the products thereof (2001-08-07),
14. 6171873 - Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information (2001-01-09),
15. 6153536 - Method for mounting wafer frame at back side grinding (BSG) tool (2000-11-28),

Title: The Innovations of Donald W Brouillette

Introduction

Donald W Brouillette is a notable inventor based in St. Albans, Vermont, with a remarkable portfolio of 17 patents. His work primarily focuses on advancements in adhesive technologies and semiconductor manufacturing processes. Brouillette's contributions have significantly impacted the fields of electronics and materials science.

Latest Patents

One of his latest patents is for an ultraviolet energy curable tape and method of making a semiconductor chip using the tape. This innovative tape comprises an adhesive material that includes a UV energy curable oligomer, a UV energy initiator, and a material that emits optical light when the tape composition is substantially fully cured. The semiconductor chip made using this tape represents a significant advancement in the efficiency and effectiveness of chip manufacturing.

Career Highlights

Brouillette has spent a significant portion of his career at International Business Machines Corporation (IBM), where he has been instrumental in developing cutting-edge technologies. His expertise in adhesive materials and semiconductor processes has led to numerous innovations that enhance product performance and reliability.

Collaborations

Throughout his career, Brouillette has collaborated with several talented individuals, including Ronald Lee Mendelson and Timothy Charles Krywanczyk. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Donald W Brouillette's contributions to the field of invention, particularly in adhesive technologies and semiconductor manufacturing, highlight his innovative spirit and dedication to advancing technology. His work continues to influence the industry and inspire future innovations.

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