The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
May. 15, 2001
Applicant:
Inventors:
Donald W. Brouillette, St. Albans, VT (US);
Robert F. Cook, Putnam Valley, NY (US);
Thomas G. Ference, Essex Junction, VT (US);
Wayne J. Howell, Williston, VT (US);
Eric G. Liniger, Danbury, CT (US);
Ronald L. Mendelson, Richmond, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/906 ;
U.S. Cl.
CPC ...
H01L 2/906 ;
Abstract
A semiconductor structure with greatly reduced backside chipping and cracking, as well as increased die strength, accommodation of compact assembly with a carrier such as another semiconductor chip, and resistance to package damage is provided by dicing chips from a wafer in a manner that chamfers edges of the chips. Similar advantages are obtained in multi-chip structure.