Williston, VT, United States of America

Wayne John Howell


Average Co-Inventor Count = 4.0

ph-index = 33

Forward Citations = 3,394(Granted Patents)

Forward Citations (Not Self Cited) = 3,361(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • South Burlington, VT (US) (1995 - 1999)
  • Wiliston, VT (US) (2001)
  • Williston, VT (US) (1995 - 2008)

Company Filing History:


Years Active: 1995-2008

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Areas of Expertise:
Multi-Chip Stack
Semiconductor Testing
Chip-On-Chip Packaging
Wafer Level Test
Self-Aligned Connector
Micro-Flex Technology
Through-Chip Conductors
Integrated Circuit Chip Edges
Rolling Ball Connector
Alpha-Particle Detector
Electrical Contact Array
66 patents (USPTO):Explore Patents

Title: Innovations of Wayne John Howell in Semiconductor Packaging

Introduction

Wayne John Howell, based in Williston, Vermont, is an accomplished inventor with a remarkable portfolio of 66 patents. His innovative work has significantly contributed to advancements in semiconductor technology, particularly in the areas of testing, burn-in, and packaging solutions.

Latest Patents

One of Howell's latest inventions is a "Carrier for test, burn-in, and first level packaging." This innovation involves a plurality of semiconductor devices being placed on a carrier for testing or burn-in purposes. The carrier is designed to be cut into single chip-on-carrier components or multi-chip-on-carrier components. This unique dual-purpose function allows the carrier to serve both for testing and for packaging. Notably, a lead reduction mechanism, such as a built-in self-test engine, can be incorporated to enhance the reliability of the chips during these processes. Ultimately, the final package comprises at least one known good die, and can include various configurations, such as an array of chips or stacked configurations, significantly improving yield and efficiency in semiconductor manufacturing.

Career Highlights

Wayne John Howell has contributed extensively to his field during his tenure at International Business Machines Corporation (IBM). His work has paved the way for innovative packaging techniques that streamline production processes while enhancing product quality. Howell's prolific output is evidenced by his 66 patents, showcasing his dedication to pushing the boundaries of engineering and technology.

Collaborations

Throughout his career, Howell has collaborated with notable coworkers such as Claude Louis Bertin and Thomas George Ference. These partnerships have fostered an environment of creativity and exploration, allowing for unique insights and advancements in semiconductor technology.

Conclusion

Wayne John Howell's contributions to semiconductor device packaging illustrate the vital role of innovation in the tech industry. With a deep commitment to his craft and a portfolio of patents that reflect his expertise, Howell continues to influence the future of semiconductor technology, ensuring that it remains at the forefront of engineering excellence.

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