The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Mar. 30, 2000
Applicant:
Inventors:
Thomas G. Ference, Essex Junction, VT (US);
Wayne J. Howell, Williston, VT (US);
William R. Tonti, Essex Junction, VT (US);
Richard Q. Williams, Essex Junction, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract
The present invention provides a method of forming a low profile chip interconnection, and the interconnection so formed. A recessed contact area is formed at an edge of the wafer. A conductive material is deposited within the adjacent contact areas of each recess, thereby electrically connecting the two chips. The recess may have substantially perpendicular sides, or sloped sides.