The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Feb. 27, 1998
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
Applicant:
Inventors:
Donald W. Brouillette, St. Albans, VT (US);
Robert F. Cook, Putnam Valley, NY (US);
Thomas G. Ference, Essex Junction, VT (US);
Wayne J. Howell, Williston, VT (US);
Eric G. Liniger, Danbury, CT (US);
Ronald L. Mendelson, Richmond, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1301 ; H01L 2/146 ; H01L 2/178 ; B26D 3/00 ; B26D 3/02 ; B26D 3/08 ;
U.S. Cl.
CPC ...
H01L 2/1301 ; H01L 2/146 ; H01L 2/178 ; B26D 3/00 ; B26D 3/02 ; B26D 3/08 ;
Abstract
A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.