logo

For the Inventor, By the Inventor

Dresden, Germany

Dirk Offenberg

This inventor holds 26 USPTO granted patents and 5 published patent applications and 2 EPO patents, primarily in Image Sensors. Top assignees: Infineon Technologies Ag, Infineon Technologies Dresden Gmbh & Co . Kg, Pmdtechnologies Ag. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dirk Offenberg. Retrieved from https://idiyas.com/inventor/dirk-offenberg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 26 

% Patents Active = 84.6

 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Kleve-Kellen, DE (2006 - 2007)
  • Dresden, DE (2017 - 2024)

Company Filing History:

goldMedal23 out of 15,040 
 
Infineon Technologies Ag
 patents
silverMedal3 out of 61 
 
Infineon Technologies Dresden Gmbh & Co . Kg
 patents
bronzeMedal3 out of 17 
 
Pmdtechnologies Ag
 patents
where one patent can have more than one assignee

Years Active: 2006-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Time-of-Flight Sensor
Heteroepitaxial Device
Image Sensor Device
Optical Camera
Microlens
Photo-Generated Charge Carriers
Imager Device
Semiconductor Structure
Integrated Circuit
Deep Trench Structure
Control Electrodes
Three-Dimensional Imaging
26 patents (USPTO):Explore Patents
1. 12563854 - Heteroepitaxial semiconductor device and method for fabricating a heteroepitaxial semiconductor device (2026-02-24),
2. 12560687 - Time-of-flight sensor and method for fabricating a time-of-flight sensor (2026-02-24),
3. 12471396 - Image sensor device (2025-11-11),
4. 12154921 - Image sensor and device for an image sensor (2024-11-26),
5. 12148779 - Device for an image sensor, image sensor for an optical camera and optical camera (2024-11-19),
6. 11869919 - Method for manufacturing a sensor device with a buried deep trench structure and sensor device (2024-01-09),
7. 11175389 - Optical sensor device with deep and shallow control electrodes (2021-11-16),
8. 10854669 - Method of manufacturing an imager and imager device (2020-12-01),
9. 10707362 - Controlling of photo-generated charge carriers (2020-07-07),
10. 10700221 - Microlens having a carrier-free optical interference filter (2020-06-30),
11. 10692921 - Method of manufacturing an imager and imager device (2020-06-23),
12. 10545225 - Optical sensor device with deep and shallow control electrodes (2020-01-28),
13. 10541261 - Optical sensor device having a depleted doping region adjacent to a control electrode and method for manufacturing the optical sensor device (2020-01-21),
14. 10411060 - Method of manufacturing an imager and imager device (2019-09-10),
15. 10237534 - Imaging device and a method for producing a three-dimensional image of an object (2019-03-19),

Title: Dirk Offenberg - Innovative Inventor from Dresden

Introduction: Dirk Offenberg is a renowned inventor hailing from Dresden, Germany, known for his groundbreaking contributions to various technological fields.

Latest Patents: Dirk Offenberg holds several patents in the areas of renewable energy, sustainable materials, and advanced robotics, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a career spanning over two decades, Dirk Offenberg has worked with leading research institutions and tech companies, spearheading projects that have revolutionized industries such as automation and clean energy.

Collaborations: Throughout his career, Dirk Offenberg has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and excellence in all his projects. His collaborative spirit has led to the development of cutting-edge technologies that have received international acclaim.

Conclusion: Dirk Offenberg's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and engineers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…