logo

For the Inventor, By the Inventor

Sunnyvale, CA, United States of America

David Wolk Mendel

This inventor holds 116 USPTO granted patents and 2 published patent applications and 10 EPO patents, primarily in Integrated Circuit Design (CPC class 326 39). Top assignees: Altera Corporation, Intel Corporation. Active years: 1994-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David Wolk Mendel. Retrieved from https://idiyas.com/inventor/david-wolk-mendel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 116 

% Patents Active = 81.0

 

Average Co-Inventor Count = 2.4

ph-index = 18

Forward Citations = 1,400(Granted Patents)

Forward Citations (Not Self Cited) = 1,345(Dec 10, 2025)


Inventors with similar research interests:

🔬 See more inventors

Location History:

  • Menlo Park, CA (US) (1994)
  • San Jose, CA (US) (2015 - 2018)
  • Sunnyvale, CA (US) (1997 - 2024)

Company Filing History:

goldMedal106 out of 4,331 
 
Altera Corporation
 patents
silverMedal10 out of 56,290 
 
Intel Corporation
 patents

Years Active: 1994-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Integrated Circuit
Multichip Package
Signal Skew Compensation
Voltage Regulation
Protocol-Configurable Data Paths
Transceiver System
Error Correction
Clock Selection Circuitry
Heat Spreader
FIFO Buffer
Communication Link
Timestamp Generation
116 patents (USPTO):Explore Patents
1. 12620981 - Techniques for reduction of degradation in channels caused by bias temperature instability (2026-05-05),
2. 12381770 - Systems and methods for transmitting and receiving auxiliary data (2025-08-05),
3. 12191893 - Seemingly monolithic interface between separate integrated circuit die (2025-01-07),
4. 12135667 - Interface bridge between integrated circuit die (2024-11-05),
5. 12086088 - Multichip package with protocol-configurable data paths (2024-09-10),
6. 11693810 - Interface bridge between integrated circuit die (2023-07-04),
7. 11669479 - Multichip package with protocol-configurable data paths (2023-06-06),
8. 11349587 - Generating a timestamp (2022-05-31),
9. 11294842 - Multichip package with protocol-configurable data paths (2022-04-05),
10. 11237998 - Interface bridge between integrated circuit die (2022-02-01),
11. 11115025 - Universal transceiver container (2021-09-07),
12. 11100029 - Interface bridge between integrated circuit die (2021-08-24),
13. 11075648 - Seemingly monolithic interface between separate integrated circuit die (2021-07-27),
14. 10884964 - Multichip package with protocol-configurable data paths (2021-01-05),
15. 10699045 - Methods and apparatus for regulating the supply voltage of an integrated circuit (2020-06-30),

Title: Unveiling the Inventive Mind of David Wolk Mendel

Introduction: David Wolk Mendel is a prolific inventor based in Sunnyvale, CA, with an impressive track record of 111 patents to his name. His innovative spirit and expertise have led to groundbreaking developments in the field of integrated circuit technology.

Latest Patents: Among his latest patents is an "Interface bridge between integrated circuit die," revolutionizing communication between integrated circuit dies. Additionally, Mendel's "Multichip package with protocol-configurable data paths" showcases his ingenuity in creating advanced integrated circuit packages with multiple dies.

Career Highlights: Mendel has made significant contributions during his tenure at renowned companies like Altera Corporation and Intel Corporation. His wealth of experience and dedication to innovation have played a vital role in shaping the technological landscape of modern integrated circuits.

Collaborations: Throughout his career, Mendel has collaborated with esteemed professionals in the field, including Bruce B Pedersen and Gregg William Baeckler. Together, they have worked on cutting-edge projects and pushed the boundaries of integrated circuit design.

Conclusion: David Wolk Mendel's innovative prowess and relentless pursuit of excellence have solidified his reputation as a trailblazer in the realm of integrated circuit technology. With a remarkable portfolio of patents and a history of successful collaborations, Mendel continues to inspire and drive technological advancement in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…