Boise, ID, United States of America

David S Meyaard

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignees: Micron Technology Incorporated, Intel Corporation. Active years: 2019-2024.

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 6.8

ph-index = 3

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 2019-2024

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5 patents (USPTO):Explore Patents

Title: David S Meyaard: Innovator in Semiconductor Technology

Introduction

David S Meyaard is a notable inventor based in Boise, ID (US), recognized for his contributions to semiconductor technology. He holds a total of 5 patents, showcasing his innovative approach to memory devices and semiconductor structures.

Latest Patents

One of his latest patents is a 3D memory device with a top wordline contact located in a protected region during planarization. This invention addresses the challenges of erosion during the chemical mechanical polish (CMP) process. The memory device features a stack of multiple layers with a plurality of wordlines and wordline contacts, designed to enhance performance and reliability. Another significant patent involves stair step structures that include insulative materials, detailing a method for forming semiconductor structures that improve the efficiency of the manufacturing process.

Career Highlights

David has worked with prominent companies in the technology sector, including Micron Technology Incorporated and Intel Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

David has collaborated with talented individuals such as John B Matovu and Gowrisankar Damarla, contributing to advancements in their respective fields.

Conclusion

David S Meyaard's work in semiconductor technology exemplifies the spirit of innovation and dedication to improving memory devices. His patents reflect a commitment to advancing the industry and addressing complex challenges in semiconductor manufacturing.

Profile summary based on public USPTO records.
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