The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Nov. 30, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Deepak Thimmegowda, Freemont, CA (US);

Owen W. Jungroth, Sonora, CA (US);

David S. Meyaard, Boise, ID (US);

Khaled Hasnat, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11531 (2017.01); G11C 16/04 (2006.01); H01L 27/11551 (2017.01); H01L 27/11573 (2017.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 27/11578 (2017.01); H01L 27/1157 (2017.01); H01L 27/11575 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11531 (2013.01); G11C 16/04 (2013.01); H01L 21/76898 (2013.01); H01L 23/5226 (2013.01); H01L 23/53271 (2013.01); H01L 27/1157 (2013.01); H01L 27/11551 (2013.01); H01L 27/11573 (2013.01); H01L 27/11575 (2013.01); H01L 27/11578 (2013.01); H01L 27/11582 (2013.01);
Abstract

The present disclosure relates to providing a wordline bridge between wordlines of adjacent tiles of memory cells to reduce the number wordline staircases in 3D memory arrays. An apparatus may include a memory array having memory cells. The memory array includes a first block of pages of the memory cells in a first tile and a second block of pages of the memory cells in a second tile. The apparatus may also include a polysilicon wordline bridge that couples first wordlines of the first block to second wordlines of the second block to couple the first tile to the second tile. The wordline bridge may be formed by applying a hard mask over the first tile, the second tile, and over a portion of polysilicon that connects the first tile to the second tile.


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