Company Filing History:
8 out of 4,564 
2 out of 74 
1 out of 10 
Years Active: 2011-2018
Title: The Innovative Contributions of David Lee Dean
Introduction
David Lee Dean is a notable inventor based in Litchfield Park, Arizona. He has made significant contributions to the field of electronic assembly, holding a total of 12 patents. His work focuses on innovative methods to enhance the efficiency and functionality of electronic devices.
Latest Patents
One of Dean's latest patents is titled "Electronic assembly with thermal channel and method of manufacture thereof." This invention involves the creation of an electronic assembly that features a thermal channel designed to control airflow for effective heat dissipation. The assembly comprises a top board, a bottom board, and a subassembly that includes a rail, an airflow tab, and an interconnect. The subassembly serves to couple the top and bottom boards together. The rail is equipped with an opening that allows air to pass through, while the interconnect is positioned to face the airflow tab, facilitating the transfer of electrical signals between the two boards and channeling air through the rail's opening.
Another patent by Dean also focuses on an electronic assembly and its manufacturing method. This invention includes an airflow bracket that features a circular rail and an airflow tab, which are electrically coupled. A top board is attached to the circular rail, ensuring electrical connectivity, while a bottom board is also attached to the circular rail, forming a thermal channel that directs air through a vent opening of the circular rail.
Career Highlights
Throughout his career, David Lee Dean has worked with prominent companies in the technology sector, including SanDisk Technologies Inc. and SanDisk Enterprise IP LLC. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Dean has collaborated with several talented individuals in his field, including Robert W. Ellis and Dennis Bennett. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
David Lee Dean's contributions to electronic assembly innovation are noteworthy, with a focus on improving heat dissipation and airflow management. His patents reflect a commitment to advancing technology and enhancing the performance of electronic devices.