The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Nov. 02, 2016
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

David A. Wright, Sun Tan Valley, AZ (US);

David Dean, Litchfield Park, AZ (US);

Robert W. Ellis, Phoenix, AZ (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20709 (2013.01); H05K 1/0203 (2013.01); H05K 1/0207 (2013.01); H05K 1/0254 (2013.01); H05K 1/0259 (2013.01); H05K 1/181 (2013.01); H05K 7/1489 (2013.01); H05K 7/205 (2013.01); H05K 7/2039 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10159 (2013.01);
Abstract

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.


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