The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Dec. 19, 2013
Applicant:

Sandisk Enterprise Ip Llc, Milpitas, CA (US);

Inventors:

David Dean, Litchfield Park, AZ (US);

Robert Ellis, Phoenix, AZ (US);

Assignee:

SanDisk Enterprise IP LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06F 1/20 (2006.01); H05K 13/00 (2006.01); G06F 1/18 (2006.01); H01L 23/34 (2006.01); H05K 1/02 (2006.01); G11C 5/04 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G06F 1/185 (2013.01); H01L 23/34 (2013.01); H05K 1/0209 (2013.01); H05K 13/0023 (2013.01); G11C 5/04 (2013.01); H05K 3/366 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10159 (2013.01);
Abstract

The various implementations described herein include systems, methods and/or devices used to manage heat flow for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one embodiment, heat sinks are disposed on front sides of a first module and a second module in the electronic system, and at least one heat sink in the second module is disposed between at least two heat sinks in the first module. In some embodiments, the number of heat sinks and/or a subset of geometric parameters for the locations, sizes and shapes of the heat sinks are configured for the purpose of disturbing and mixing air flow that passes an air gap between the front sides of the first and second modules.


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