Sandisk Technologies Inc.

Sandisk Enterprise IP LLC

Smart Storage Systems, Inc.

Adtron Corporation

David Lee Dean

Robert W Ellis

Dennis Bennett

David A Wright

Scott E Harrow

In accordance with some implementations of this invention, an electronic assembly is formed with a thermal channel that controls an air flow for the purpose of dissipating heat generated in the electronic assembly. The electronic assembly includes a top board, a bottom board and a subassembly that further includes a rail, an airflow tab and an interconnect. The subassembly couples the top and bottom boards together. The rail has an opening through which air passes. The interconnect faces the airflow tab, carries electrical signals between the top board and the bottom board, and is configured to channel air directed through the opening of the rail.

Electronic assembly with thermal channel and method of manufacture thereof

An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.

Heat dissipation for substrate assemblies

The system for redirecting airflow includes multiple electronic assemblies arranged adjacent to one another. Each electronic assembly includes a substrate having a substantially flat first surface and an opposing substantially flat second surface. Electronic devices are coupled to each of the first and second surfaces. Each surface also has one or more tabs coupled thereto, where each tab is configured to redirect the airflow over a least one electronic device.

System and method for redirecting airflow across an electronic assembly

Various embodiments described herein include systems, methods and/or devices for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connecting module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

Self-supporting thermal tube structure for electronic assemblies

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.

Various embodiments described herein disclose systems, methods and/or devices used to dissipate heat generated by electronic components of an electronic assembly that further includes a first assembly rail, a top circuit board and a bottom circuit board. The first assembly rail includes a first card guide structure and a second card guide structure that are arranged on a first side of the first assembly rail near two opposite ends of the assembly rail. The top and the bottom circuit boards are mechanically coupled to the first and second card guide structures of the first assembly rail, respectively. The top circuit board is parallel to the bottom circuit board, and separated from the bottom circuit board by a predefined distance. The first assembly rail, the top circuit board and the bottom circuit board together form a channel there between for receiving a heat dissipating airflow.

Thermal tube assembly structures

A test system, and a method of manufacture thereof, including: a thermal management head including a heat spreader; an electronic device in direct contact with the heat spreader; and an electrical current for transferring energy between the heat spreader and the electronic device.

Test system with localized heating and method of manufacture thereof

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board with one or more heat generating components coupled thereto. The electronic assembly further includes a second circuit board with one or more heat sensitive components coupled thereto. The electronic assembly also includes a thermal barrier interconnect. The thermal barrier interconnect electrically couples the first circuit board to the second circuit board. In some embodiments, thermal barrier interconnect is a flexible interconnect with a lower thermal conductivity than the first circuit board and the second circuit board. The thermal barrier interconnect forms a thermal barrier between the first and second circuit boards which protects the heat sensitive components from the heat generating components.

Thermal isolation techniques

An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.

Electronic system with heat extraction and method of manufacture thereof

The various implementations described herein include systems, methods and/or devices used to manage heat flow for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one embodiment, heat sinks are disposed on front sides of a first module and a second module in the electronic system, and at least one heat sink in the second module is disposed between at least two heat sinks in the first module. In some embodiments, the number of heat sinks and/or a subset of geometric parameters for the locations, sizes and shapes of the heat sinks are configured for the purpose of disturbing and mixing air flow that passes an air gap between the front sides of the first and second modules.

System and method for heat dissipation

A connector clamp, for a hard drive having a first connector for mating with an external connector, having a top clamp and a bottom clamp. The top clamp includes a longitudinal section from which two arms extend, each arm including an integrally formed hole, and a bottom face, wherein a first gasket is attached to the bottom face and contacts the external connector when mated with the first connector. The bottom clamp includes an integrally formed first set of holes to receive a first set of screws for insertion into the hard drive, an integrally formed second set of holes to receive a second set of screws for insertion into the holes of the top clamp, and a top face, wherein a second gasket is attached to the top face and contacts the external connector when mated with the first connector.

Growing community of inventors

Litchfield Park, AZ, United States of America

David Lee Dean