David Gani

This inventor holds 34 USPTO granted patents and 11 published patent applications, primarily in Semiconductor Packaging. Top assignees: Stmicroelectronics Gmbh, Stmicroelectronics (Grenoble 2) Sas, Stmicroelectronics (Rousset) Sas. Active years: 2013-2026.

USPTO Granted Patents = 34 (Patent Applications = 11)

% Patents Active = 94.1

Average Co-Inventor Count = 1.8

ph-index = 4

Forward Citations = 40(Granted Patents)

Location History:

Yishun, SG (2013)
Singapore, SG (2013 - 2024)
Choa Chu kang, SG (2017 - 2024)

Company Filing History:

39 out of 2,891

Stmicroelectronics Gmbh

patents

2 out of 645

Stmicroelectronics (Grenoble 2) Sas

patents

1 out of 1,020

Stmicroelectronics (Rousset) Sas

patents

where one patent can have more than one assignee

Years Active: 2013-2026

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Areas of Expertise:

WLCSP

Proximity Sensor

Image Sensor

Multi-Chip Package

Ambient Light Sensor

Gas Release Holes

Thermal Management

Optical Assembly

Interconnection Bridge

Electromagnetic Shielding

Stacked Electronic Chips

Lead Frame Design

34 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12733516 - Semiconductor package with exposed electrical contacts (2026-09-08),

2. 12557694 - Semiconductor package with gas release holes (2026-02-17),

3. 12364038 - Sensor die package (2025-07-15),

4. 12356743 - Slanted glass edge for image sensor package (2025-07-08),

5. 12136608 - Multi-chip package (2024-11-05),

6. 11996397 - Wafer level proximity sensor (2024-05-28),

7. 11942496 - Slanted glass edge for image sensor package (2024-03-26),

8. 11908831 - Method for manufacturing a wafer level chip scale package (WLCSP) (2024-02-20),

9. 11828875 - Proximity sensor with integrated ALS (2023-11-28),

10. 11742437 - WLCSP with transparent substrate and method of manufacturing the same (2023-08-29),

11. 11585847 - Crack detection integrity check (2023-02-21),

12. 11581289 - Multi-chip package (2023-02-14),

13. 11581280 - WLCSP package with different solder volumes (2023-02-14),

14. 11562937 - Semiconductor package with protected sidewall and method of forming the same (2023-01-24),

15. 11527511 - Electronic device comprising a support substrate and stacked electronic chips (2022-12-13),

Title: The Innovative Journey of David Gani

Introduction: David Gani, a pioneering inventor hailing from Singapore, SG, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: David Gani's latest patents include a cutting-edge smart home automation system that has revolutionized the way people interact with their living spaces.

Career Highlights: With a career spanning over two decades, David Gani has established himself as a leading figure in the tech industry, with a keen focus on developing solutions that enhance everyday life.

Collaborations: Throughout his career, David Gani has collaborated with top research institutions and leading tech companies to bring his inventions to life, showcasing his ability to work across disciplines and industries.

Conclusion: David Gani's relentless pursuit of innovation and his passion for creating technology that improves lives have solidified his reputation as a visionary inventor in the global tech community.