The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Feb. 09, 2023
Applicant:
Stmicroelectronics Pte Ltd, Singapore, SG;
Inventors:
Yong Chen, Singapore, SG;
David Gani, Choa Chu kang, SG;
Assignee:
STMICROELECTRONICS PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49866 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 25/16 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/06503 (2013.01);
Abstract
A multi-chip package including a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first side having a first conductive layer, a second side having a second conductive layer, and an edge, the first conductive layer coupled to the second conductive layer at a location adjacent to the edge. The second integrated circuit is coupled to the second conductive layer of the first integrated circuit.