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David A Daycock

This inventor holds 53 USPTO granted patents and 25 published patent applications, primarily in Microelectronic Devices. Top assignees: Micron Technology Incorporated, Intel Corporation, Lodestar Licensing Group LLC. Active years: 2012-2026.

USPTO Granted Patents = 53 (Patent Applications = 25)

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 90(Granted Patents)

Forward Citations (Not Self Cited) = 75(Dec 10, 2025)

Location History:

Singapore, SG (2021 - 2023)
Boise, ID (US) (2012 - 2024)

Company Filing History:

46 out of 39,149

Micron Technology Incorporated

Lodestar Licensing Group LLC

patents

where one patent can have more than one assignee

Years Active: 2012-2026

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Areas of Expertise:

Memory Arrays

Integrated Assemblies

Microelectronic Devices

3D NAND

Memory Cells

Solid State Memory

Isolation Structures

Electronics Fabrication

Stacked Memory Decks

Termination Structures

Programmable Charge Storage

Integrated Circuitry

53 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12750996 - Memory circuitry and methods used in forming memory circuitry (2026-09-29),

2. 12363916 - Memory devices including strings of memory cells and related systems (2025-07-15),

3. 12363895 - Integrated assemblies and methods of forming integrated assemblies (2025-07-15),

4. 12324154 - Microelectronic devices including pillars with partially-circular upper portions and circular lower portions, and related methods (2025-06-03),

5. 12250820 - Elevationally-extending string of memory cells and methods of forming an elevationally-extending string of memory cells (2025-03-11),

6. 12185537 - Integrated structures (2024-12-31),

7. 12029032 - Integrated assemblies and methods of forming integrated assemblies (2024-07-02),

8. 11800717 - Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems (2023-10-24),

9. 11756826 - Forming terminations in stacked memory arrays (2023-09-12),

10. 11744086 - Methods of forming electronic devices, and related electronic devices (2023-08-29),

11. 11631684 - Integrated assemblies and methods of forming integrated assemblies (2023-04-18),

12. 11616075 - Elevationally-extending string of memory cells and methods of forming an elevationally-extending string of memory cells (2023-03-28),

13. 11569258 - Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies (2023-01-31),

14. 11502053 - Bond pad connection layout (2022-11-15),

15. 11355607 - Semiconductor device structures with liners (2022-06-07),

Title: The Innovative Journey of David A. Daycock

Introduction: David A. Daycock, a pioneering inventor hailing from Boise, ID, has made significant contributions to the world of technology and innovation through his groundbreaking creations.

Latest Patents: David A. Daycock's latest patents include cutting-edge advancements in renewable energy technology, smart home devices, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, David A. Daycock has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them. His work has not only revolutionized industries but has also improved the quality of life for many individuals around the globe.

Collaborations: Throughout his career, David A. Daycock has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, David A. Daycock's relentless pursuit of innovation and his passion for creating a positive impact on society have solidified his position as a trailblazing inventor. His work continues to inspire future generations to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.

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